Peter is a systems engineer and inventor. He has authored 18 issued patents and over 20 new patents in progress.

Peter is available as an expert witness in the following areas:

• Electrical Engineering
• Systems Engineering
• Semiconductor Packaging
• Electrostatics for Printers & Motors & Cleaning Devices

He can perform patent development, assist with patent evaluations, provide expert opinions and reports, depositions, testimony and litigation support.

Peter's electronic packaging inventions include new flip chip connectors; rework for high assembly yield; advanced cooling methods; copper channels carrying chilled water; new test methodology for high speed functional test at the system level; test chips; wafer-level packaging approaches to automated assembly and test; solder free assembly method using stud bumps and buckled pillars.

Peter has invented a film to be applied to solar cell arrays, supporting an automated cleaning process. Both dry and wet cleaning cycles can be performed.

As a technologist and system designer Peter has invented and developed multiple system hardware and software designs to various levels of maturity. Commercial systems include a high speed printer employing dry toner, electrostatic imaging and voltage traveling waves; electrostatic motors and generators operating at high voltage; compact size and high energy efficiency; stacked disk architecture and high surface charge density using ion implantation;3D electronic systems including stacked semiconductor devices employing through silicon vias (TSVs). Military systems include reconnaissance systems having multiple air-borne vehicles, platforms and ground stations.

Peter has presented many conference papers and technical talks. He won the Best of Conference Award at the 2nd International Wafer Level Packaging Conference in San Jose, CA, for his Repairable 3D Semiconductor Subsystem