Peter has worked with some of the best minds in the intellectual property business including the late Aldo Test, formerly of Flehr, Hohbach, Test, Albritton & Herbert; Ed Bachand, Partner at Dorsey & Whitney; and Ron Laurie, Managing Director of Inflexion Point Strategy. He owns 13 issued patents plus over 25 patents in process, and has performed as an expert witness through Round Table Group and Silicon Valley Expert Witness Group.

Peter is currently directing his consulting business toward technical support for patent evaluations, including expert opinions, reports, depositions, testimony and litigation.

Peter's electronic packaging inventions include two new flip chip connectors that emphasize rework for high assembly yield, eliminating epoxy underfill; advanced cooling methods including copper channels carrying chilled water; a new test methodology for high speed functional test at the system level employing a socketed FPGA test chip; wafer-level approaches to automated assembly and test; and a solder free assembly method.

As a technologist and system designer Peter has invented and developed multiple system hardware and software designs to various levels of maturity. Commercial systems include a high speed printer employing dry toner, electrostatic imaging and voltage traveling waves; electrostatic motors and generators operating at high voltage, having a compact size and high energy efficiency, employing a stacked disk architecture and high surface charge density using ion implantation; and 3D electronic systems including stacked semiconductor devices employing through silicon vias (TSVs). Military systems include reconnaissance systems having multiple air-borne vehicles, platforms and ground stations.

Peter won the Best of Conference Award at the 2nd International Wafer Level Packaging Conference in San Jose, CA, for his Repairable 3D Semiconductor Subsystems